Apparatus for processing substrates or wafers

ABSTRACT

A vacuum apparatus includes process chambers, and a transfer chamber coupled to the process chambers. The transfer chamber includes one or more vacuum ports, thorough which a gas inside the transfer chamber is exhausted, and vent ports, from which a vent gas is supplied. The one or more vacuum ports and the vent ports are arranged such that air flows from at least one of the vent ports to the one or more vacuum ports are line-symmetric with respect to a center line of the transfer chamber.

CROSS-REFERENCE TO RELATED APPLICATIONS

The application claims priority to U.S. Provisional Patent Application62/586,580, filed Nov. 15, 2017, the entire disclosure of which isincorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to a vacuum apparatus, more particularly,to a vacuum apparatus for processing wafers or substrates.

BACKGROUND

A semiconductor manufacturing process or a flat panel display device(e.g., liquid crystal display) requires various vacuum processing suchas a film deposition process and an etching process. During vacuumprocessing, undesired byproducts are generated and become particleswhich reduce yield of semiconductor devices or flat panel devices. Thus,controlling particles caused from the byproducts is one of the issues tobe solved in the semiconductor device manufacturing operations and/orthe flat panel display manufacturing operations.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a vacuum processing apparatus according toan embodiment of the present disclosure.

FIG. 2 is a schematic view of a vacuum processing apparatus according toan embodiment of the present disclosure.

FIG. 3 is a schematic view of a vent/vacuum port arrangement accordingto an embodiment of the present disclosure.

FIG. 4 is a schematic view of gas flows according to an embodiment ofthe present disclosure.

FIG. 5 is a schematic view of gas flows according to an embodiment ofthe present disclosure.

FIG. 6 is a schematic view of gas flows according to an embodiment ofthe present disclosure.

FIG. 7 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure.

FIG. 8 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure.

FIG. 9 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure.

FIG. 10 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure.

FIG. 11 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure.

FIG. 12 is a schematic view of a vacuum processing apparatus accordingto an embodiment of the present disclosure.

FIG. 13 is a schematic view of a vacuum processing apparatus accordingto an embodiment of the present disclosure.

FIG. 14 is a schematic view of a vacuum processing apparatus accordingto an embodiment of the present disclosure.

FIG. 15 is a schematic view of a vacuum processing apparatus accordingto an embodiment of the present disclosure.

FIG. 16 is a schematic view of a vacuum processing apparatus accordingto an embodiment of the present disclosure.

FIG. 17 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure.

FIG. 18 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure.

FIG. 19 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure.

FIG. 20 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure.

DETAILED DESCRIPTION

It is to be understood that the following disclosure provides manydifferent embodiments, or examples, for implementing different featuresof the invention. Specific embodiments or examples of components andarrangements are described below to simplify the present disclosure.These are, of course, merely examples and are not intended to belimiting. For example, dimensions of elements are not limited to thedisclosed range or values, but may depend upon process conditions and/ordesired properties of the device. Moreover, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed interposing the first and second features, suchthat the first and second features may not be in direct contact. Variousfeatures may be arbitrarily drawn in different scales for simplicity andclarity. In the accompanying drawings, some layers/features may beomitted for simplification.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The device may be otherwise oriented (rotated 90 degrees orat other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly. In addition, the term“made of” may mean either “comprising” or “consisting of.” Further, inthe following fabrication process, there may be one or more additionaloperations in/between the described operations, and the order ofoperations may be changed. In the present disclosure, a phrase “one ofA, B and C” means “A, B and/or C” (A, B, C, A and B, A and C, B and C,or A, B and C), and does not mean one element from A, one element from Band one element from C, unless otherwise described.

A vacuum processing apparatus used in semiconductor device manufacturingoperations and/or flat panel display manufacturing operations include,for example, a plasma processing chamber, such as a plasma dry etchingchamber or a photo resist ashing chamber; a film deposition chamber,such as a chemical vapor deposition (CVD) process chamber, an epitaxialgrowth chamber, a sputtering chamber, an atomic layer deposition (ALD)chamber or a physical vapor deposition (PVD) chamber; a thermaloperation chamber, such as an annealing chamber or a oxidation chamber.During semiconductor wafer or glass substrate processing within thesevacuum processing chambers, films and/or byproducts caused by etchingoperations or film formation operation are deposited on inner walls ofthe vacuum processing chamber. Further, a vacuum processing apparatusincludes a non-processing chamber, such as a chamber for measuringphysical, chemical and/or electrical property of the pre-processedand/or post-processed wafer or substrate. In addition, the vacuumprocessing apparatus includes one or more load lock chambers and one ormore transfer chambers that connect the one or more load lock chambersand the processing chambers.

A vacuum processing chamber generally includes one or more vacuum portswhich are connected to a pumping system including one or more vacuumpumps. The vacuum apparatus also includes one or more vent ports tointroduce a gas or air when opening the vacuum apparatus or whenincreasing an inside pressure. When reducing the pressure and/orincreasing the pressure inside the vacuum processing chamber, air or gasflows are generated inside the vacuum processing chamber. Such air orgas flows may blow up the films or the byproduct deposited on innerwalls of the vacuum processing chamber and/or may locally pile up thefilms or the byproducts inside the vacuum processing chamber.

In the present disclosure, by adjusting the arrangement of vent portsand vacuum ports inside vacuum chambers, air or gas flows inside thevacuum chambers are controlled.

FIGS. 1 and 2 show a schematic view of a vacuum processing apparatusaccording to an embodiment of the present disclosure. FIGS. 1 and 2 showonly elements necessary to explain the features of the presentembodiments, and it should be understood that one or more additionalfeatures not expressly shown in FIGS. 1 and 2 are included in the vacuumprocessing apparatus.

The vacuum processing apparatus 10 as shown in FIG. 1 includes atransfer chamber 20 to which vacuum processing or measurement chambers31, 32, 33 and 34 are connected via a gate valve 25, respectively. Thevacuum processing or measurement chambers 31, 32, 33 and 34 are one ormore of a plasma processing chamber, such as a plasma dry etchingchamber or a photo resist ashing chamber; a film deposition chamber,such as a CVD process chamber, an epitaxial growth chamber, a sputteringchamber, an ALD chamber or a PVD chamber; a thermal operation chamber,such as an annealing chamber or an oxidation chamber, or any othervacuum chambers. In some embodiments, all the vacuum processing ormeasurement chambers 31, 32, 33 and 34 are the same type of chambers(e.g., the same type of processing chambers), and in other embodiments,at least one of the vacuum processing or measurement chambers 31, 32, 33and 34 is a different type of vacuum chamber. The processing orprocesses in the present disclosure may include measurement operations.Thus, in the followings, the vacuum processing or measurement chambermay be simply referred to as a vacuum processing chamber.

Further, one or more load lock chambers 50 are also connected to thetransfer chamber 20 via a gate valve 25, respectively. Inside thetransfer chamber, a substrate handling and transferring mechanism 40(e.g., a wafer handler) having one or more movable arms is disposed. Asemiconductor wafer WF or a glass substrate for a flat panel display istransferred from one chamber to another chamber by the substratehandling and transferring mechanism 40. In FIG. 1, four vacuumprocessing or measurement chambers 31, 32, 33 and 34 and two load lockchambers 50 are connected to the transfer chamber 20, but the numbers ofchambers are not limited to. Further, in some embodiments, two or moretransfer chambers connected via gate valves, respectively, are used inthe vacuum processing apparatus 10.

FIG. 2 is a schematic view of a vacuum processing apparatus illustratinga vacuum system and a vent system according to an embodiment of thepresent disclosure.

In the transfer chamber 20, one or more vent ports 100 and one or morevacuum ports 120 are disposed. The vent ports 100 are used to introducea vent gas, such as N₂ or air, into the transfer chamber, and the vacuumports 120 are used to evacuate the transfer chamber. The gas is notlimited to a vent gas and may be a process gas.

More specifically, the transfer chamber 20 includes five vent ports 101,102, 103, 104 and 105, and three vacuum ports 121, 122 and 123 in someembodiments. Each of the vent ports 101, 102, 103, 104 and 105 is fluidcommunicably connected to a vent gas supply source 60 via gas channelson which one or more valves 111, 112, 113, 114 and 115 are disposed,respectively in some embodiments. The vent gas supply source 60 is a gasbomb or a gas tank storing pressurized vent gas such as N₂ or air, or afacility gas supply system.

Each of the vacuum ports 111, 112 and 113 is fluid communicablyconnected to a pumping system 70 via gas channels on which one or morevalves 131, 132 and 133 are disposed, respectively, in some embodiments.The pumping system 70 includes one or more dry pumps, such as a turbomolecular pump (TMP), a sorption pump, a sputter ion pump, a mechanicalbooster pump or a cryo pump. The valves 111-115 and 131-132 arerespectively one of an open- close valve and a flow-amount controllablevalve.

Further, one or more process gas ports 190 are provided inside thevacuum processing or measurement chambers 31, 32, 33 and 34. Further,one or more vacuum ports are provided inside each of the vacuumprocessing or measurement chambers 31, 32, 33 and 34, which areconnected to the pumping system 70, respectively. In some embodiments,the pumping system is provided for the vacuum processing or measurementchambers separately from those for the transfer chamber 20. In someembodiments, the vent port connected to the vent gas supply 60 is notprovided inside the vacuum processing or measurement chambers, and inother embodiments, one or more vent ports are provided inside the vacuumprocessing or measurement chambers.

At least a part of the operations of the vacuum processing apparatus 10is controlled by one or more controllers 80 connected to or includingone or more storages 90. The controller 80 is a computer systemincluding one or more processors and the storage 90 stores controlprogram, in some embodiments. When the control program is executed bythe processor, the controller 80 controls operations of, for example,the substrate handling and transferring mechanism 40, the load lockchambers 50, gate valves 25, the valves 111-115 for the vent ports101-105, valves 131-133 for the vacuum ports 121-123, a pumping system70 and each process or measurement chambers 31-34. In some embodiments,the controller 80 controls the valves the valves 111-115 for the ventports 101-105 and/or valves 131-133 for the vacuum ports 121-123individually.

FIG. 3 is a schematic view of a vent/vacuum port arrangement inside thetransfer chamber 20 shown in FIGS. 1 and 2 according to an embodiment ofthe present disclosure.

As shown in FIG. 3, at least one of the vacuum ports 121-123 and atleast one of the vent ports 101-105 are line-symmetrically arrangedinside the transfer chamber 20 with respect to the center line CL of thetransfer chamber 20. The center line CL passes through the geometriccenter G of the transfer chamber 20 when viewed from the above. Thegeometric center G can be the crossing point of the diagonal lines ofthe shape of a bottom base plate of the transfer chamber 20 in someembodiments in some embodiments. If the diagonal lines do not cross atthe one point and form a polygon, the geometric center G is the centerof gravity of the polygon in some embodiments. If the shape of a bottombase plate of the transfer chamber 20 is a triangle, the geometriccenter G is the center of the triangle. The center line CL also passesone of the side walls 22 constituting the transfer chamber 20. Morespecifically, the center line CL is perpendicular to the one of the sidewalls 22.

In FIG. 3, the vent port 105 and the vacuum ports 121-123 areline-symmetrically arranged with respect to the center line CL insidethe transfer chamber 20. Also, the vent ports 101-104 areline-symmetrically arranged with respect to the center line CL insidethe transfer chamber 20. Further, all of the vacuum ports 121-123 andvent ports 101-105 are line-symmetrically arranged inside the transferchamber 20 with respect to the center line CL.

In addition, as shown in FIG. 3, at least one vent port is provided inthe transfer chamber 20 in front of each of the process chambers. Forexample, the vent port 101 is located in front of the gate valve of theprocess chamber 31, the vent port 102 is located in front of the gatevalve of the process chamber 32, the vent port 103 is located in frontof the gate valve of the process chamber 33, and the vent port 104 islocated in front of the gate valve of the process chamber 34,respectively. The process chambers 31-34 are also line-symmetricallyarranged with respect to the center line CL, and thus the vent ports101-104 are line-symmetrically arranged inside the transfer chamber 20with respect to the center line CL. A distance between the gate valve ofeach of the process chambers 31-34 and the corresponding vent port is ina range from about 0.5 mm to about 5 cm in plan view in someembodiments.

As shown in FIG. 3, while individual vent ports 101-104 are provided forrespective process chambers 31-34, one or more common vent ports 105 areprovided inside the transfer chamber 20, in some embodiments. At leastone common vent port is provided on the center line CL of the transferchamber 20 in some embodiments. When two or more common vent ports areprovided, the common vent ports are line-symmetrically arranged withrespect to the center line CL.

Similarly, at least one vacuum port is provided in the transfer chamber20. At least one vacuum port (e.g., 122) is provided on the center lineCL of the transfer chamber 20 in some embodiments. When two or morevacuum ports are provided, the vacuum ports are line-symmetricallyarranged with respect to the center line CL. Further, as shown in FIG.3, at least one of the vacuum ports is provided in the transfer chamber20 in front of the load lock chamber 50, in some embodiments. In such acase, the vacuum port(s) is located closer to the load lock chamber thanthe vent ports in some embodiments. In other embodiments, the commonvent port is located closer to the load lock chamber than the vacuumports and the vacuum ports are arranged in front of opposite one 24 ofthe side walls. Further, in some embodiments, the vacuum ports areprovided inside the transfer chamber 20 such that the vacuum ports arearranged on a line L parallel to one of side walls (e.g., 22) of thetransfer chamber 20 as shown in FIG. 3.

FIG. 4 is a schematic view of gas flows inside the transfer chamber 20of the vacuum processing apparatus 10 shown in FIGS. 1-3 according to anembodiment of the present disclosure.

The vacuum processing apparatus 10 operates in various operation modesor conditions. For example, in an idle condition, no semiconductor waferor substrate is loaded inside the vacuum processing apparatus 10. In aprocessing condition/mode, one or more wafers or substrates aretransferred from the load lock chamber 50 to one or more of the processor measurement chambers 31-34 by the substrate handling and transferringmechanism 40 inside the transfer chamber, and the wafers or thesubstrates are processed at the processing or measurement chambers.

In the idle condition, all the gate valves are closed and a vent gas inintroduced into the transfer chamber with vacuum pumping to purge theinside the transfer chamber. The purge operation may be performed atanother operation condition. In some embodiments, to purge the insidethe transfer chamber 20, the valve 112 for the common vent port 105 andthe valves 131- 133 for the vacuum ports 121-123 are opened by theoperation of the controller 80. As set forth above, the common vent port105 and the vacuum ports 121-123 are line-symmetrically arranged withrespect to the center line CL, gas flows GF from the common vent port105 to the vacuum ports are line-symmetric with respect to the centerline CL of the transfer chamber 20, as shown in FIG. 4.

As set forth above, films or byproducts are generated in the processingchambers 31-34 and when the gate valve 25 is opened to transfer thewafer or substrate from/to the processing chamber, the films or thebyproducts move from the processing chamber to the transfer chamber.When the gas flows are not symmetric, which may be caused by, forexample, opening the valve for the vent port 101 and the valve for thevacuum port 122, a dead space is generated at the corner of the transferchamber near the vent ports 105 and 103. When the dead space isgenerated, the films or byproducts are not purged by the purge gas flowand tend to locally deposited in the dead space. Such locally depositedfilm or byproducts may be blown or stirred up by movement of the waferhandling and transferring mechanism or by other air movement inside thetransfer chamber, and may fall on the wafer or substrate.

In contrast, when the gas flows GF are symmetric as shown in FIG. 4, itis possible to minimize the generation of a dead space during the purgeoperation and thus to prevent the films or byproducts from being locallydeposited. Accordingly, it is possible to improve the yield of theprocessed wafer or substrate and to reduce a maintenance cycle of thevacuum processing apparatus 10.

In FIG. 4, only the common vent port 105 is opened among the vent ports.In other embodiments, the vent ports 102 and 103 are opened togetherwith or instead of the common vent port 105 during the purge operation.In such a case, the gas flows are also symmetric with respect to thecenter line CL. In other embodiments, all the vent ports 101-105 areopened.

In the present disclosure, the line-symmetric arrangement of the ventports and/or the vacuum ports does not necessarily require mathematicalaccuracy. The positions of the vent ports and/or the vacuum port candeviate from the exact line-symmetric positions as long as thesubstantially symmetric gas flows can be obtained. For example, thedeviation of the position from the exact positions can be 0 to about 2cm in some embodiments.

FIGS. 5 and 6 are schematic views of gas flows when the gate valve isopened to transfer the semiconductor wafer or the substrate from/to theprocessing chamber according to an embodiment of the present disclosure.

When a wafer or a substrate is transferred from or to the processingchamber 31-34 to or from the transfer chamber 20, the pressure insidethe processing chamber is lower than the pressure inside the transferchamber, in some embodiments. In other embodiments, as set forth above,no vent port for supplying a vent gas (e.g., N₂) is provided inside thevacuum processing or measurement chambers. In such cases, to purge thevacuum processing or measurement chambers, a vent gas is supplied fromone of the vent ports in the transfer chamber to the vacuum processingor measurement chamber. In some embodiments, the valve for the vent portis opened and then the gate valve is opened. The timing of opening thegate valve and opening valve for a vent port is not particularlylimited.

In the present embodiments, to purge a specific processing chamber, onlythe valve for the corresponding vent port located in front of (andclosest to) the specific processing chamber is opened as shown in FIGS.5 and 6. For example, as shown in FIG. 5, when the gate valve 25 for theprocessing chamber 31 is opened, the valve 111 (see, FIG. 2) is openedto introduce the vent gas from the vent port 101 into the processingchamber 31 to minimize the gas flows GF1, while other vent valves areclosed. The valves for the vacuum ports 121-123 inside the transferchamber are also closed in some embodiments. Similarly, in FIG. 6, whenthe gate valve 25 for the processing chamber 33 is opened, the valve 113(see, FIG. 2) is opened to introduce the vent gas from the vent port 103into the processing chamber 33 to minimize the gas flows GF2, whileother vent valves are closed.

When vent ports 101-104 provided, respectfully, to the correspondingprocessing chambers 31-34 are not provided and only the common vent port105 is provided, gas flow travel distances for the processing chambers31-14 are different from each other (e.g., at least different betweenthe processing chamber 31 and processing chamber 32. Different lengthsof gas flow travel paths may cause various problems in the purgeoperation. For example, a purge operation for the processing chamber 31may be insufficient compared with a purge operation for the processingchamber 32 when only the common vent port 105 is used, or the longer gasflow traveling path may cause more particles thrown up by the gas flows.Although it may be possible to place the common vent port at theposition having an equal distance from the processing chambers, the gasflow traveling paths are generally long and due to the wafer handlingand transferring mechanism located at the center of the transferchamber, the gas flows may be disturbed causing non-uniform gas flows.

In contrast, by providing individual vent ports for the processingchamber, respectively, it is possible to minimize the gas flow travelingpaths and to equalize the gas flow traveling paths from the vent port tothe processing chamber. Accordingly, it is possible to prevent undesiredparticles thrown up by the gas flows, and to more effectively purgeindividual processing chambers.

FIGS. 7-16 are schematic views of a vent/vacuum port arrangement and/orthe configuration of transfer chambers according to various embodimentsof the present disclosure. One or more features of two or more followingembodiments can be combined with one or more following embodiments.Configurations, element, features, materials and/or dimensions the sameas or similar to those for FIGS. 1-6 may be employed in the followingembodiments, and the detailed explanations may be omitted. Further, oneor more features of the forgoing embodiments can be combined with one ormore following embodiments.

FIG. 7 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure. As shown in FIG. 7, six(6) vacuum processing or measurement chambers 31-34 and 36-37 areconnected via gate valves, respectively, to a transfer chamber 20Ahaving a rectangular shape. The additional vacuum processing ormeasurement chambers 36 and 37 are the same type as the vacuumprocessing or measurement chambers 31- 34 in some embodiments, anddifferent types in other embodiments. Further, as shown in FIG. 7,additional vent ports 106 and 107 are provided in front of the vacuumprocessing or measurement chambers 36 and 37, respectively. The ventports 101-107 are line-symmetrically arranged inside the transferchamber 20A with respect to the center line CL.

FIG. 8 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure. In FIG. 8, similar toFIGS. 1-6, four vacuum processing or measurement chambers 31-34 areprovided to the transfer chamber 20B. The transfer chamber 20B includestwo pairs of three vacuum ports and five vent ports as shown in FIG. 8.The vacuum ports 121-123 are provided at positions close to the sidewall 22B and the vacuum ports 124-126 are provided at positions closerto the opposing side wall 24B. In some embodiments, the vacuum ports ineach set are arranged on a line parallel to the respective side walls(e.g., 22B or 24B) of the transfer chamber 20B. The vent ports 101-104are provided to the corresponding vacuum processing or measurementchambers 31-34, respectively, similar to FIGS. 1-6. In some embodiments,the common vent port 105 is provided at or near the geometric center ofthe transfer chamber 20B. The vent ports 101-105 are line-symmetricallyarranged inside the transfer chamber 20B with respect to the center lineCL, and the vacuum ports 121-126 are also line-symmetrically arrangedinside the transfer chamber 20B with respect to the center line CL.

FIG. 9 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure. In FIG. 9, similar toFIGS. 1-6, four vacuum processing or measurement chambers 31-34 areprovided to the transfer chamber 20C. The transfer chamber 20C includesonly one vacuum port 122. The configuration of the vent ports 101-105are the same as the configuration of vent ports shown in FIGS. 1-6. Thevacuum port 121 and the vent ports 101-105 are line-symmetricallyarranged inside the transfer chamber 20C with respect to the center lineCL.

FIG. 10 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure. In FIG. 10, similar toFIGS. 1-6, four vacuum processing or measurement chambers 31-34 areprovided to the transfer chamber 20D. The transfer chamber 20D includesfour vent ports for respective vacuum processing or measurement chambers31-34 and two common vent ports 108 and 109 are provided as shown inFIG. 10. The vent ports 108-109 are line-symmetrically arranged insidethe transfer chamber 20D with respect to the center line CL, and thevent ports 101-105 and 108-109 are also line-symmetrically arrangedinside the transfer chamber 20D with respect to the center line CL. Thevacuum ports 121-123 are line-symmetrically arranged inside the transferchamber 20D with respect to the center line CL. In FIG. 10, the centerline CL does not pass through any of the vent ports.

FIG. 11 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure. In FIG. 11, similar toFIGS. 1-6, four vacuum processing or measurement chambers 31-34 areprovided to the transfer chamber 20E. In the embodiments of FIG. 11, aset of two or more vent ports are provided respectively for thecorresponding vacuum processing or measurement chambers 31-34,respectively. For example, a set of vent ports 101D is provided in frontof the vacuum processing or measurement chamber 31, a set of vent ports102D is provided in front of the vacuum processing or measurementchamber 32, a set of vent ports 103D is provided in front of the vacuumprocessing or measurement chamber 33, and a set of vent ports 104D isprovided in front of the vacuum processing or measurement chamber 34,respectively. When the size of a semiconductor wafer is large (e.g., 12inches) or a large glass substrate for a flat display panel is used, thesize, in particular the width, of the vacuum processing or measurementchambers also becomes large. Providing a set of vent ports isadvantageous for such large vacuum processing or measurement chamber.Further, in some embodiments, as shown in FIG. 11, the vent ports of theset of vent ports (e.g., 101D) are line-symmetrically arranged withrespect to the center line CCL of the corresponding vacuum processing ormeasurement chamber 31.

FIG. 12 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure. In this embodiment, theshape of the transfer chamber 1020 is hexagonal having six side walls.One or more load lock chambers 1050 are provided to one of the six sidewalls via a gate valve 1025, and five vacuum processing or measurementchambers 1031, 1032, 1033, 1034 and 1035 are connected to the transferchamber 1020 via gate valves 1025, respectively. In some embodiments,three vacuum ports 1120 are provided in fro of the load lock chamber1050, and vent ports 1100 are provided respectively to the correspondingvacuum processing or measurement chambers 1031-1035. As shown in FIG.12, the vent ports 1110 and the vacuum ports 1120 are line-symmetricallyarranged with respect to the center line CL of the transfer chamber1020. In some embodiments, no common vent port is provided in thetransfer chamber 1020. In other embodiments, one or more common ventports are provided line-symmetrically with respect to the center lineCL.

In a purge operation inside the transfer chamber 1020 in the idlecondition, the vent port 1100 located in front of the vacuum processingor measurement chamber 1033 functions as a common vent port similar tothe common vent port 105 shown in FIG. 4, in some embodiments. In otherembodiments, vent ports in front of the vacuum processing or measurementchambers 1032 and 1034 function as common vent ports similar to thecommon vent port 105 shown in FIG. 4.

FIG. 13 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure. In this embodiment, theshape of the transfer chamber 2020 is hexagonal having six side walls.Two load lock chambers 2051, 2052 are provided to two of the six sidewalls via gate valves 2025, and four vacuum processing or measurementchambers 2031, 2032, 2033 and 2034 are connected to the transfer chamber2020 via gate valves 2025, respectively. In some embodiments, a commonvent port 2105 is provided. The common vent port 2015 is not provided inother embodiments, and in such a case, the vent ports provided in frontof the vacuum processing or measurement chambers 2032 and 2033 functionsas a common vent port shown in FIG. 4. The vent ports 2100 are providedrespectively to the corresponding vacuum processing or measurementchambers 2031-2034. Further, the vacuum ports 2120 are providedrespectively to the corresponding load lock chambers 2050. Further, insome embodiments, a common vacuum port 2122 is provided between the loadlock chambers 2050.

As shown in FIG. 13, the vent ports 2100 and 2105 and the vacuum ports2120 and 2122 are line-symmetrically arranged with respect to the centerline CL of the transfer chamber 2020.

FIG. 14 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure. In this embodiment, theshape of the transfer chamber 3020 is elongated pentagonal having fiveside walls. As shown in FIG. 14, six (6) vacuum processing ormeasurement chambers 3031-3036 are connected via gate valves 3025,respectively, to a transfer chamber 3020. Two load lock chambers 3050are provided to one of the side walls of the transfer chamber 3020. Thevent ports 3100 are provided respectively in front of the correspondingvacuum processing or measurement chambers 3031-3036, and a common ventport 3105 is also provided. Three vacuum ports 3120 are provided infront of the load lock chambers 3050. The vent ports 3100 and 3105 andthe vacuum ports 3120 are line-symmetrically arranged inside thetransfer chamber 3020 with respect to the center line CL.

FIG. 15 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure. In this embodiment, theshape of the transfer chamber 4020 is a rectangular or a square. Sixvacuum processing or measurement chambers 4031, 4032, 4033, 4034, 4035and 4036 are provided. Two of the vacuum processing or measurementchambers are respectively connected to each of three side walls of thetransfer chamber 4020, and two load lock chambers 4050 are connected tothe remaining side wall of the transfer chamber 4020. The vent ports4100 are provided respectively in front of the corresponding vacuumprocessing or measurement chambers 4031-4036, and a common vent port4105 is also provided. In some embodiments, the common port 4105 is notprovided. Three vacuum ports 4120 are provided in front of the load lockchambers 4050. The vent ports 4100 and 4105 and the vacuum ports 4120are line-symmetrically arranged inside the transfer chamber 4020 withrespect to the center line CL.

FIG. 16 is a schematic view of a vent/vacuum port arrangement accordingto another embodiment of the present disclosure. In this embodiment, theshape of the transfer chamber 5020 is pentagonal having five side walls.As shown in FIG. 15, four vacuum processing or measurement chambers5031-5034 are connected via gate valves 5025, respectively, to atransfer chamber 5020. One or more load lock chambers 5050 are providedto one of the side walls of the transfer chamber 5020. The vent ports5100 are provided respectively in front of the corresponding vacuumprocessing or measurement chambers 5031-5034, and a common vent port5105 is also provided. In other embodiments, no common vent port isprovided. Three vacuum ports 5120 are provided in front of the load lockchamber 5050. The vent ports 5100 and 5105 and the vacuum ports 5120 areline-symmetrically arranged inside the transfer chamber 3020 withrespect to the center line CL.

FIGS. 17-20 are schematic views of a gas supply/vacuum port arrangementinside a vacuum processing or measurement chamber according to anembodiment of the present disclosure.

In the foregoing embodiments, symmetric port arrangements inside atransfer chamber are explained. However, a symmetric port arrangement isnot limited to the transfer chamber, but can be applied to any othervacuum chamber having one or more gas supply ports and one or morevacuum ports. One or more features of two or more following embodimentscan be combined with one or more following embodiments. Configurations,element, features, materials and/or dimensions the same as or similar tothose for FIGS. 1-16 may be employed in the following embodiments, andthe detailed explanations may be omitted. Further, one or more featuresof the forgoing embodiments can be combined with one or more followingembodiments.

FIG. 17 is a schematic view of a gas supply/vacuum port arrangementaccording to an embodiment of the present disclosure. As shown in FIG.17, a vacuum chamber 11A includes a chamber body 6020A and a gate valve6025A. The chamber body 6020A includes at least one gas supply port andat least one vacuum port. In some embodiments, one gas supply port 6100Aand one vacuum port 6120A are provided on the center line CL of thechamber body 6020A. According to the port arrangement of FIG. 17, in,for example a purge operation, gas flows from the gas supply port 6100Ato the vacuum port 6120A are symmetric with respect to the center lineCL, thereby minimizing generation of a dead space. In some embodiments,the gas supply port 6100A is located close to the gate valve 6025A andthe vacuum port 6120A are located to the opposite side of the chamberbody 6020A, and in other embodiments, the vacuum port 6120A are locatedclose to the gate valve 6025A and the gas supply port 6100A is locatedto the opposite side of the chamber body 6020A.

FIG. 18 is a schematic view of a gas supply/vacuum port arrangementaccording to another embodiment of the present disclosure. As shown inFIG. 18, a vacuum chamber 11B includes a chamber body 6020B and a gatevalve 6025B. The chamber body 6020B includes at least one gas supplyport and at least one vacuum port. In some embodiments, one gas supplyport 6100B and two vacuum ports 6120B are provided line-symmetricallywith respect to the center line CL of the chamber body 6020B. Accordingto the port arrangement of FIG. 18, in, for example a purge operation,gas flows from the gas supply port 6100B to the vacuum ports 6120B aresymmetric with respect to the center line CL, thereby minimizinggeneration of a dead space. In some embodiments, the gas supply port6100B is located close to the gate valve 6025B and the vacuum ports6120B are located to the opposite side of the chamber body 6020B, and inother embodiments, the vacuum ports 6120B are located close to the gatevalve 6025B and the gas supply port 6100B is located to the oppositeside of the chamber body 6020B.

FIG. 19 is a schematic view of a gas supply/vacuum port arrangementaccording to another embodiment of the present disclosure. As shown inFIG. 19, a vacuum chamber 11C includes a chamber body 6020C and a gatevalve 6025C. The chamber body 6020C includes at least one gas supplyport and at least one vacuum port. In some embodiments, two gas supplyports 6100C and two vacuum ports 6120C are provided line-symmetricallywith respect to the center line CL of the chamber body 6020C. Accordingto the port arrangement of FIG. 19, in, for example a purge operation,gas flows from the gas supply ports 6100C to the vacuum ports 6120C aresymmetric with respect to the center line CL, thereby minimizinggeneration of a dead space. In some embodiments, the gas supply ports6100C are located close to the gate valve 6025C and the vacuum ports6120C are located to the opposite side of the chamber body 6020C, and inother embodiments, the vacuum ports 6120C are located close to the gatevalve 6025C and the gas supply ports 6100C are located to the oppositeside of the chamber body 6020C.

FIG. 20 is a schematic view of a gas supply/vacuum port arrangementaccording to another embodiment of the present disclosure. As shown inFIG. 20, a vacuum chamber 11D includes a chamber body 6020D and a gatevalve 6025D. The chamber body 6020D includes at least one gas supplyport and at least one vacuum port. In some embodiments, two gas supplyports 6100D and one vacuum port 6120D are provided line-symmetricallywith respect to the center line CL of the chamber body 6020D. Accordingto the port arrangement of FIG. 20, in, for example a purge operation,gas flows from the gas supply ports 6100D to the vacuum port 6120D aresymmetric with respect to the center line CL, thereby minimizinggeneration of a dead space. In some embodiments, the gas supply ports6100D are located at the middle of the chamber body 6020D and the vacuumport 6120D are located to the end side of the chamber body 6020Dopposite to the gate valve 6025D. In other embodiments, two vacuum ports6120D are located at the middle of the chamber body 6020D and one gassupply port 6100D is located to the end side of the chamber body 6020D.

It will be understood that not all advantages have been necessarilydiscussed herein, no particular advantage is required for allembodiments or examples, and other embodiments or examples may offerdifferent advantages.

In accordance with an aspect of the present disclosure, a vacuumapparatus includes process chambers, and a transfer chamber coupled tothe process chambers. The transfer chamber includes one or more vacuumports, through which a gas inside the transfer chamber is exhausted, andvent ports, from which a vent gas is supplied. The one or more vacuumports and the vent ports are arranged such that air flows from at leastone of the vent ports to the one or more vacuum ports are line-symmetricwith respect to a center line of the transfer chamber. In one or more ofthe foregoing and following embodiments, the vent ports areline-symmetrically arranged with respect to the center line of thetransfer chamber. In one or more of the foregoing and followingembodiments, at least one vent port is provided in the transfer chamberin front of each of the process chambers. In one or more of theforegoing and following embodiments, at least one common vent port isprovided on the center line of the transfer chamber. In one or more ofthe foregoing and following embodiments, two or more vacuum ports areprovided in the transfer chamber. In one or more of the foregoing andfollowing embodiments, the two or more vacuum ports areline-symmetrically arranged with respect to the center line of thetransfer chamber. In one or more of the foregoing and followingembodiments, at least one of the two or more vacuum ports is provided onthe center line of the transfer chamber. In one or more of the foregoingand following embodiments, the vacuum apparatus further includes a loadlock chamber connected to the transfer chamber. In one or more of theforegoing and following embodiments, at least one of the one or morevacuum ports is provided in the transfer chamber in front of the loadlock chamber, and is located closer to the load lock chamber than thevent ports. In one or more of the foregoing and following embodiments, agate valve is provided between the transfer chamber and each of theprocess chambers.

According to another aspect of the present disclosure, a vacuumapparatus includes process chambers, a transfer chamber coupled to theprocess chambers, gate valves provided between the transfer chamber andthe process chambers, respectively, a pump system, a gas supply, one ormore vacuum ports disposed inside the transfer chamber and connected tothe pump system via one or more vacuum valves, respectively, vent portsdisposed inside the transfer chamber and connected to the gas supply viavent valves, respectively, and a controller for controlling at least theone or more vacuum valves and the vent valves. The vent ports areline-symmetrically arranged with respect to a center line of thetransfer chamber. The center line is a line passing through a geometriccenter of the transfer chamber and is perpendicular to one side wall orone corner of the transfer chamber in plan view. In one or more of theforegoing and following embodiments, when all the gate valves areclosed, the controller opens at least one vacuum valve and at least onevent valve such that air flows from at least one vent port to at leastone vacuum port are line-symmetric with respect to a center line of thetransfer chamber. In one or more of the foregoing and followingembodiments, at least one vent port is provided in the transfer chamberin front of each of the process chambers. In one or more of theforegoing and following embodiments, when one of the gate valvescorresponding to one of the process chambers is opened, the controlleropens one of the vent valves corresponding to one of the vent ports infront of corresponding one of the process chambers. In one or more ofthe foregoing and following embodiments, wherein, when the one of thevent valve opened, the controller does not open remaining vent valves.In one or more of the foregoing and following embodiments, at least onecommon vent port is provided on the center line of the transfer chamber.In one or more of the foregoing and following embodiments, when all thegate valves are closed, the controller opens at least one vent valve forthe at least one common vent port and opens the one or more vacuumvalves.

In accordance with another aspect of the present disclosure, a vacuumapparatus for processing a semiconductor wafer includes process chambersincluding at least one selected from the group consisting of a plasmaetching chamber and a film deposition chamber, a transfer chambercoupled to the process chambers, and a wafer handler disposed inside thetransfer chamber. The transfer chamber includes one or more vacuumports, through which a gas inside the transfer chamber is exhausted, andvent ports, from which a vent gas is supplied. The vent ports areline-symmetrically arranged with respect to a center line of thetransfer chamber. The center line is a line passing through a geometriccenter of the transfer chamber and is perpendicular to one side wall orone corner of the transfer chamber in plan view. In one or more of theforegoing and following embodiments, the vacuum apparatus furtherincludes a load lock chamber. The one or more vacuum ports are providedin the transfer chamber in front of the load lock chamber, and arelocated closer to the load lock chamber than the vent ports. In one ormore of the foregoing and following embodiments, two or more vacuumports are provided inside the transfer chamber, and are arranged on aline parallel to one of side walls of the transfer chamber.

In accordance with another aspect of the present disclosure, a method isfor operating a vacuum apparatus. The vacuum apparatus includes processchambers, a transfer chamber coupled to the process chambers, gatevalves provided between the transfer chamber and the process chambers,respectively, a pump system, a gas supply, one or more vacuum portsdisposed inside the transfer chamber and connected to the pump systemvia one or more vacuum valves, respectively, and vent ports disposedinside the transfer chamber and connected to the gas supply via ventvalves, respectively. At least one vent port is provided in front ofeach of the process chambers. In the method, when moving a wafer fromthe transfer chamber to one of the process chamber or from one of theprocess chamber to the transfer chamber, one of the gate valvescorresponding to the one of the process chambers is opened. One of thevent valve corresponding to one of the vent ports in front of the one ofthe process chambers is opened.

In accordance with another aspect of the present disclosure, a method isfor operating a vacuum apparatus. The vacuum apparatus includes processchambers, a transfer chamber coupled to the process chambers, gatevalves provided between the transfer chamber and the process chambers,respectively, a pump system, a gas supply, one or more vacuum portsdisposed inside the transfer chamber and connected to the pump systemvia one or more vacuum valves, respectively, and vent ports disposedinside the transfer chamber and connected to the gas supply via ventvalves, respectively. In the method, when all the gate valves areclosed, at least one vacuum valve and at least one vent valve are openedsuch that air flows from at least one vent port to at least one vacuumport are line-symmetric with respect to a center line of the transferchamber. In one or more of the foregoing and following embodiments, onlyone vent valve is opened while remaining vent valves are closed suchthat the air flows from only one vent port to at least one vacuum portare line-symmetric with respect to the center line of the transferchamber. In one or more of the foregoing and following embodiments, twoor more vacuum ports and two or more vacuum valves are provided, and twoor more vacuum ports are opened such that air flows from at least onevent port to the two or more vacuum ports are line- symmetric withrespect to the center line of the transfer chamber.

The foregoing outlines features of several embodiments or examples sothat those skilled in the art may better understand the aspects of thepresent disclosure. Those skilled in the art should appreciate that theymay readily use the present disclosure as a basis for designing ormodifying other processes and structures for carrying out the samepurposes and/or achieving the same advantages of the embodiments orexamples introduced herein. Those skilled in the art should also realizethat such equivalent constructions do not depart from the spirit andscope of the present disclosure, and that they may make various changes,substitutions, and alterations herein without departing from the spiritand scope of the present disclosure.

What is claimed is:
 1. A vacuum apparatus, comprising: process chambers;a transfer chamber coupled to the process chambers, wherein: thetransfer chamber includes: one or more vacuum ports, thorough which agas inside the transfer chamber is exhausted; and vent ports, from whicha vent gas is supplied, and the one or more vacuum ports and the ventports are arranged such that air flows from at least one of the ventports to the one or more vacuum ports are line-symmetric with respect toa center line of the transfer chamber.
 2. The vacuum apparatus of claim1, wherein the vent ports are line-symmetrically arranged with respectto the center line of the transfer chamber.
 3. The vacuum apparatus ofclaim 1, wherein at least one vent port is provided in the transferchamber in front of each of the process chambers.
 4. The vacuumapparatus of claim 3, wherein at least one common vent port is providedon the center line of the transfer chamber.
 5. The vacuum apparatus ofclaim 1, wherein two or more vacuum ports are provided in the transferchamber.
 6. The vacuum apparatus of claim 5, wherein the two or morevacuum ports are line-symmetrically arranged with respect to the centerline of the transfer chamber.
 7. The vacuum apparatus of claim 5,wherein at least one of the two or more vacuum ports is provided on thecenter line of the transfer chamber.
 8. The vacuum apparatus of claim 1,further comprising a load lock chamber connected to the transferchamber.
 9. The vacuum apparatus of claim 8, wherein at least one of theone or more vacuum ports is provided in the transfer chamber in front ofthe load lock chamber, and is located closer to the load lock chamberthan the vent ports.
 10. The vacuum apparatus of claim 1, wherein a gatevalve is provided between the transfer chamber and each of the processchambers.
 11. A vacuum apparatus, comprising: process chambers; atransfer chamber coupled to the process chambers; gate valves providedbetween the transfer chamber and the process chambers, respectively; apump system; a gas supply; one or more vacuum ports disposed inside thetransfer chamber and connected to the pump system via one or more vacuumvalves, respectively; vent ports disposed inside the transfer chamberand connected to the gas supply via vent valves, respectively; and acontroller for controlling at least the one or more vacuum valves andthe vent valves, wherein the vent ports are line-symmetrically arrangedwith respect to a center line of the transfer chamber, the center linebeing a line passing through a geometric center of the transfer chamberand being perpendicular to one side wall or one corner of the transferchamber in plan view.
 12. The vacuum apparatus of claim 11, wherein,when all the gate valves are closed, the controller opens at least onevacuum valve and at least one vent valve such that air flows from atleast one vent port to at least one vacuum port are line-symmetric withrespect to a center line of the transfer chamber.
 13. The vacuumapparatus of claim 11, wherein at least one vent port is provided in thetransfer chamber in front of each of the process chambers.
 14. Thevacuum apparatus of claim 13, wherein when one of the gate valvescorresponding to one of the process chambers is opened, the controlleropens one of the vent valves corresponding to one of the vent ports infront of corresponding one of the process chambers.
 15. The vacuumapparatus of claim 14, wherein, when the one of the vent valves opened,the controller does not open remaining vent valves.
 16. The vacuumapparatus of claim 13, wherein at least one common vent port is providedon the center line of the transfer chamber.
 17. The vacuum apparatus ofclaim 16, wherein, when all the gate valves are closed, the controlleropens at least one vent valve for the at least one common vent port andopens the one or more vacuum valves.
 18. A method for operating a vacuumapparatus, the vacuum apparatus including: process chambers; a transferchamber coupled to the process chambers; gate valves provided betweenthe transfer chamber and the process chambers, respectively; a pumpsystem; a gas supply; one or more vacuum ports disposed inside thetransfer chamber and connected to the pump system via one or more vacuumvalves, respectively; and vent ports disposed inside the transferchamber and connected to the gas supply via vent valves, respectively,the method comprising, when all the gate valves are closed, opening atleast one vacuum valve and at least one vent valve such that air flowsfrom at least one vent port to at least one vacuum port areline-symmetric with respect to a center line of the transfer chamber.19. The method of claim 18, wherein only one vent valve is opened whileremaining vent valves are closed such that the air flows from only onevent port to at least one vacuum port are line-symmetric with respect tothe center line of the transfer chamber.
 20. The method of claim 18,wherein: two or more vacuum ports and two or more vacuum valves areprovided, and two or more vacuum ports are opened such that air flowsfrom at least one vent port to the two or more vacuum ports areline-symmetric with respect to the center line of the transfer chamber.